The DE400D Electron Beam Evaporator is assembled with one e-beam source, the substrate is mounting on the top
of the chamber and rotary or on the horizontal axial on the side of chamber for the substrate polar to change the
deposition angle
DE400D電子束蒸發(fā)儀配置一個電子束蒸發(fā)源，基片架裝于腔體頂部旋轉(zhuǎn)或腔體側(cè)面水平轉(zhuǎn)動的軸上基片可以改變鍍膜角度
Configuration
主要配置
| Evaporation Chamber 蒸發(fā)腔體 | 304 stainless steel chamber with viewport 蒸發(fā)腔體為304不銹鋼，并有觀察窗 |
| Vacuum Pumping 真空泵 | Cryo-pump or Turbo pump and dry rough pump 配備冷凝泵或分子泵和無油機(jī)械泵 |
| Vacuum Valve 真空閥門 | Pneumatic HV gate valves 氣動控制高真空插板閥 |
| Evaporation Source 蒸發(fā)源 | Multi pocket e-beam source 多坩堝電子束蒸發(fā)源 |
| Optional Load Lock chamber 樣品室 | 304 stainless steel chamber with viewport 蒸發(fā)腔體為304不銹鋼，并有觀察窗 |
| Sample Stage 樣品臺 | Top mount and rotary or Side mount polar Substrate 頂部安裝旋轉(zhuǎn)的樣品臺或側(cè)面安裝的轉(zhuǎn)角樣品臺 |
| Film Control 膜厚檢測 | Crystal Film thickness Monitor and Control 晶振膜厚監(jiān)控 |
| Vacuum Gauging 真空測量 | Wide range vacuum gauge and rough gauge 寬量程真空計用于測量真空和粗抽計 |
Specification
主要技術(shù)指標(biāo)
| The Base Vacuum Pressure 極限真空度 | better than 5E-8 Torr 優(yōu)于5E-8托 |
| Sample Loading Capacity 裝樣能力 | One Max. 8 inch flat substrate or multi small substrate 一個zui大8英寸的平板基片或多個小基片 |
| Rate Resolution 蒸發(fā)速率分辨率 | 0.05 Angstroms/sec |
| Thickness Resolution = 0.02 Angstroms 膜厚分辨率 | 0.02 Angstroms |
| Features 特點(diǎn) D shape Chamber of front open door for easy inside operation D型腔體前開門便于腔體內(nèi)部操作和維護(hù) Stand along system frameworks and electric rack 獨(dú)立的系統(tǒng)機(jī)架和電器柜 System and e-beam source Water Interlock 系統(tǒng)和電子束蒸發(fā)源冷水安全互鎖 Optional Substrate Cooling or heating 樣品臺可選水冷或加熱 | |
Typical Application
典型應(yīng)用
For R&D Thin Film Deposition
用于薄膜沉積研發(fā)
Ideal tools for LIFT-OFF process
用于LIFT-OFF工藝的理想平臺
Ideal tools for GLAD process with side mount substrate stage
若采用側(cè)裝樣品臺可用成為GLAD工藝的理想平臺
Evaporate metal, Semiconductor or Insulation Materials （material depends）
可蒸發(fā)金屬，半導(dǎo)體或介質(zhì)材料（視具體材料而定）
Evaporate Magnetic Materials
可蒸發(fā)磁性材料
